超声显微镜在塑封器件内部缺陷检测中的应用  

Application of Scanning Acoustic Microscope in Defect Detection of Plastic Packaging Products

作　　者：夏雷 邹治旻 张浩 XIA Lei;ZOU Zhimin;ZHANG Hao(Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2020年第3期34-39,共6页Electronic Product Reliability and Environmental Testing

摘　　要：超声扫描显微镜是广泛应用于半导体及电子行业中的一种无损检测的仪器。在半导体塑封行业中,其主要用来检测塑封产品内部的分层、空洞等缺陷,相对于其他检测设备,其在这方面具有无可比拟的优势。首先,阐述了超声显微镜的检测原理;然后,对塑封产品的检测做了具体的分析;最后,介绍了塑封器件超声扫描检查的相关标准,以期为相关工作人员更好地掌握超声显微境的工作原理和使用方法,从而提高塑封器件的可靠性有所帮助。Scanning acoustic microscope is a nondestructive testing instrument widely used in the semiconductor and electronics industries.In the semiconductor plastic packaging industry,it is mainly used to detect defects such as layering and voids in the plastic packaging products.Compared with other testing equipments,it has unparalleled advantages in this regard.Firstly,the detection principle of acoustic microscope is explained.Then,the detection of plastic packaging products is analyzed concretely.Finally,the relevant standards of acoustic scanning inspection of plastic packaging products are introduced so as to help relevant staffs better grasp the working principle and use method of scanning accoustic microscope and improve the reliability of plastic packaging products.

关 键 词：超声显微镜 塑封 内部缺陷 检测 技术原理 标准 

分 类 号：TB302.5[一般工业技术—材料科学与工程] TH742[机械工程—光学工程]