一种三维立体传输结构的分段式设计方法  

Segmented Design Method for Three-Dimensional Interconnection

作　　者：栗辰烨 李振松[1] 缪旻[1,2] LI Chenye;LI Zhensong;MIAO Min(School of Information and Communication Engineering,Bering Information Science and Technology University,Beijing 100101,CHN;National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Peking University,Beijing 100871,CHN)

机构地区：[1]北京信息科技大学信息与通信工程学院,北京100101 [2]北京大学微米纳米加工技术国家重点实验室,北京100871

出　　处：《半导体光电》2020年第3期362-367,共6页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(61674016,U1537208);北京市自然科学基金项目(4162026);北京市科技新星计划交叉学科合作资助课题(Z161100004916036)

摘　　要：随着信号频率以及芯片集成密度的持续增长,三维集成系统内部面临严重的耦合噪声问题。针对三维集成技术中广泛使用的硅通孔(TSV)和水平重布线层(RDL)构成的三维互连结构,提出了一种基于分段传输线(STL)的三维互连结构优化设计方案。通过将三维互连结构传输线按STL模式划分为数个传输线片段生成复数反射波,并运用基因算法(GA)筛选片段特征信息,从而优化反射波叠加效果,实现对传输过程中产生的信号损失进行补偿。仿真结果表明,该方法可以有效改善三维互连结构中由于耦合噪声造成的信号反射问题,提升系统传输性能。With the continuous increase of signal frequency and device integration density in electronic system,serious coupling noise problem in three-dimensional integration system becomes the bottleneck of system performance.Aiming at the three-dimensional interconnection widely used in integrated technology,which is composed of trough silicone via(TSV)and redistribution layer(RDL),an optimized design scheme for three-dimensional interconnection is proposed based on segmental transmission line(STL).In this scheme,the three-dimensional interconnection is divided into several segments under the STL requirement,and the genetic algorithm(GA)is used to screen the segments’transmission characteristics to optimize superposition effect of reflected waves,which can compensate the signal loss in the transmission process.The simulation results show that the scheme proposed in this paper reduce the coupling noise caused by wave reflection,and effectively improve the transmission performance in the three-dimensional interconnect system.

关 键 词：硅通孔(TSV) 水平布线层(RDL) 分段传输线(STL) 基因算法(GA) 三维集成技术 

分 类 号：TN402[电子电信—微电子学与固体电子学]