内标归一法测定二元锡铅焊料中锡铅元素含量  

Determination of Tin Content and Lead Content in Binary Tin-lead Solder by Internal Standard Normalization Method

作　　者：陈猛 洪诗强 王嘉子 Chen Meng;Hong Shiqiang;Wang Jiazi(Shenzhen Meixin Analysis Technology Co.,Ltd.,Shenzhen 518108,China;Shenzhen Meixin Testing Technology Co.,Ltd.,Shenzhen 518108,China)

机构地区：[1]深圳市美信分析技术有限公司,广东深圳518108 [2]深圳市美信检测技术股份有限公司,广东深圳518108

出　　处：《山东化工》2020年第13期82-83,共2页Shandong Chemical Industry

摘　　要：研究了利用电感耦合等离子体发射光谱法结合内标归一法测定二元锡铅焊料中主体元素的分析方法。确定了仪器最佳测定条件,结果表明,主体元素铅、锡的加料回收率在99. 8%~100. 7%,RSD≤0. 38%,标准样品和模拟合金测定准确度高和精密度好,能够满足二元锡铅焊料产品中锡铅含量分析的要求。An analytical method for the determination of main elements in binary tin-lead solder by inductively coupled plasma atomic emission spectrometry combined with internal standard normalization was studied.The results show that the recovery rate of the main element tin and lead is 99.8%~100.7%,RSD≤0.38%.The test of certified reference material and analog alloy has a good precision and high accuracy,which can meet the requirements of the analysis of tin and lead content in binary tin-lead solder products.

关 键 词：内标 电感耦合等离子体发射光谱法 归一 锡铅焊料 

分 类 号：O657.3[理学—分析化学]