低压等离子喷涂技术及研究现状  

Low-pressure Plasma Spraying Technology and Its Research Status

作　　者：洪敏 王善林 陈宜 邓颖 郭正华 陈卫民 吴集思 黄永德 HONG Min;WANG Shan-lin;CHEN Yi;DENG Ying;GUO Zheng-hua;CHEN Wei-min;WU Ji-si;HUANG Yong-de(Jiangxi Provincial Key Laboratory of Aerospace Component Forming and Connection,Nanchang 330063,China;Guangzhou Xianyi Electronic Technology Co.,Ltd.,Guangzhou 511400,China)

机构地区：[1]江西省航空构件成形与连接重点实验室,南昌330063 [2]广州先艺电子科技有限公司,广州511400

出　　处：《精密成形工程》2020年第3期146-153,共8页Journal of Netshape Forming Engineering

基　　金：国家自然科学基金(51965044);航空科学基金(20185456005);江西省重点研发计划(20192BBEL50002)。

摘　　要：低压等离子喷涂作为一种热喷涂技术,相比于传统的大气等离子喷涂技术以及气相物理沉积,可制备更加纯净、更为致密、结合强度更高的涂层。主要介绍了低压等离子喷涂的原理、分类及特征,回顾了低压等离子喷涂的产生及发展历程,并与等离子喷涂、超低压等离子喷涂和等离子喷射沉积相比较,分析了其在涂层制备上的独特优势。进一步叙述了低压等离子喷涂技术在制备热障涂层、燃料电池、太阳能、半导体等领域的国内外研究及应用情况,并对其发展进行了展望,指出低压等离子喷涂技术未来的重点发展方向在于对等离子喷涂焰流与材料基板作用机理进行深入研究,以及与其他前沿技术进行复合。As a thermal spraying technology, low-pressure plasma spraying technology can produce a cleaner, denser, and higher bonding strength coating than traditional atmospheric plasma spraying technology and vapor-phase physical deposition. The principle, classification and characteristics of low-pressure plasma spraying were mainly introduced and the generation and development of low-pressure plasma spraying were reviewed. Compared with plasma spraying, ultra-low-pressure plasma spraying and plasma spray deposition, the low-pressure plasma spraying technology was analyzed for its unique advantages in preparing coating. The domestic and foreign research and application of low-pressure plasma spraying technology in the preparation of thermal barrier coatings, fuel cells, solar energy, semiconductors and other fields were further described and the development was prospected. It was also pointed out that the key development direction of low-pressure plasma spraying technology in the future was the in-depth study on the plasma spray flame and the mechanism of the material substrate, as well as the combination with other cutting-edge technologies.

关 键 词：低压等离子喷涂 热障涂层 燃料电池 太阳能 半导体 

分 类 号：TG174.4[金属学及工艺—金属表面处理]