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作 者:俞浦宁 叶强 YU Puning;YE Qiang(College of Information Engineering,China Jiliang University,Hangzhou 310018,China)
出 处:《电子器件》2020年第3期624-627,645,共5页Chinese Journal of Electron Devices
摘 要:针对目前腔体三工器虽然功率容量大,但体积较大难以实现片上集成的问题,利用LTCC工艺设计了一种高隔离度小型化的三工器。采用的方法是设计3个电路块以解决阻抗匹配的问题。它们同时作为频率选择元件和匹配单元,当其中一个块用作传输通道时,其余两个在公共端提供无限输入阻抗,以防止信号进入三工器的无效部分。这使得构建块能够在输入端子处连接在一起,而无需其他匹配电路,大大简化了集成过程,提高了通道间的隔离度。此三工器在X波段(9.8 GHz^11.8 GHz)抑制达到-23 dB,优于目前常用的2.4G/5G射频芯片所需指标。In view of the fact that the current cavity triplexer has a large power capacity,but the volume is large,it is difficult to achieve on-chip integration. A high isolation and miniaturized triplexer is designed by using the LTCC process. The method used is to design three circuit blocks to solve the problem of impedance matching. They act as both a frequency selective element and a matching unit. When one of the blocks acts as a transmission channel,the other two provide an infinite input impedance at the common end to prevent the signal from entering the inactive portion of the triplexer. This allows the building blocks to be connected together at the input terminals without the need for additional matching circuitry,greatly simplifying the integration process and increasing isolation between channels. This triplexer achieves-23 dB rejection in the X-band(9.8 GHz to 11.8 GHz),which is better than the commonly used 2.4 G/5 G RF chip.
分 类 号:TN63[电子电信—电路与系统]
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