欧美军用红外通用组件技术的发展现状及趋势  

Military Status and Trends of Infrared Common Modules in Europe and America

作　　者：张坤杰 ZHANG Kunjie(Kunming Institute of Physics,Kunming 650223,China)

机构地区：[1]昆明物理研究所,云南昆明650223

出　　处：《红外技术》2020年第7期697-701,共5页Infrared Technology

摘　　要：在军用红外技术的早期发展阶段,欧美基于热成像系统关键部件的通用化形成了通用组件概念。通用组件虽然减少了工程上选择不同技术方案的余地,但是降低了热成像系统的研发成本和使用维护费用,有利于批量生产。美国以一代通用组件为基础形成了SADA系列组件,在SADA基础上推出的水平技术集成(Horizontal Technology Integration,HTI)项目,实现了军用热像仪的批量生产和装备。介绍了欧美通用组件技术的发展历史和现状。随着探测器、微电子等相关技术的发展,通用组件已经从原来的Common Module转变为Module。In the early stages of military infrared technology development,common modules were formed by standardizing the key components of thermal imaging systems in Europe and America.These common modules decreased the scope of choice between different technical proposals.However,it reduced the costs of researching,developing,operating,and maintaining infrared systems,and was beneficial to mass production.The SADA-series assembly was established in America based on the first-generation common module.The implementation of the horizontal technology integration(HTI)program based on the SADA assembly met the requirements of mass production and equipment for military thermal imaging.In this paper,the history and status of the common module in Europe and America is introduced.Common modules have become critical to the advancement of detector,microelectronics,and other related technologies.

关 键 词：通用组件 热像仪 军用红外技术 

分 类 号：TN216[电子电信—物理电子学]