Effect of thermal exposure on microstructure and mechanical properties of Al-Si-Cu-Ni-Mg alloy produced by different casting technologies  

热暴露对不同铸造工艺Al-Si-Cu-Ni-Mg合金组织和性能的影响

作　　者：Jia-ying ZHANG Li-jie ZUO Jian FENG Bing YE Xiang-yang KONG Hai-yan JIANG Wen-jiang DING 张嘉盈;左立杰;冯剑;叶兵;孔向阳;蒋海燕;丁文江(上海交通大学轻合金精密成型国家工程研究中心与金属基复合材料国家重点实验室,上海200240;江苏海洋大学机械与海洋工程学院,连云港222005;有研工程技术研究院有限公司,北京101407;上海交通大学材料科学与工程学院移动能源材料研究所,上海200240)

机构地区：[1]National Engineering Research Center of Light Alloy Net Forming and State Key Laboratory of Metal Matrix Composites,Shanghai Jiao Tong University,Shanghai 200240,China [2]School of Mechanical and Ocean Engineering,Jiangsu Ocean University,Lianyungang 222005,China [3]GRIMAT Engineering Institute Co.,Ltd.,Beijing 101407,China [4]Institute of Materials for Mobile Energy,School of Materials Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China

出　　处：《Transactions of Nonferrous Metals Society of China》2020年第7期1717-1730,共14页中国有色金属学报（英文版）

基　　金：Projects(2016YFB0700502,2016YFB0301001)supported by the National Key Research and Development Program of China。

摘　　要：The effect of thermal exposure at 350 ℃ for 200 h on microstructure and mechanical properties was investigated for Al-Si-Cu-Ni-Mg alloy, which was produced by permanent mold casting(PMC) and high pressure die casting(HPDC). The SEM and IPP software were used to characterize the morphology of Si phase in the studied alloys. The results show that the thermal exposure provokes spheroidization and coarsening of eutectic Si particles. The ultimate tensile strength of the HPDC alloy after thermal exposure is higher than that of the PMC alloy at room temperature. However, the TEPMC and TEHPDC alloys have similar tensile strength around 67 MPa at 350 ℃. Due to the coarsening of eutectic Si, the TEPMC alloy exhibits better creep resistance than the TEHPDC alloy under studied creep conditions. Therefore, the alloys with small size of eutectic Si are not suitably used at 350 ℃.研究350℃热暴露200 h对金属型铸造与高压铸造Al-Si-Cu-Ni-Mg合金组织和力学性能的影响。用扫描电镜和图片分析软件IPP表征合金中硅相的形貌。研究结果表明,高温热暴露促进共晶硅的球化和粗化。热暴露后,高压铸造合金的室温抗拉强度高于金属型铸造的,但350℃时两种合金的高温抗拉强度均为67 MPa左右。由于共晶硅的粗化,热暴露后金属型铸造合金的抗蠕变性能均优于高压铸造合金。因此,拥有细小尺寸共晶硅的合金不适于在350℃的条件下应用。

关 键 词：Al-Si-Cu-Ni-Mg alloy thermal exposure COARSENING creep behavior 

分 类 号：TG146.21[一般工业技术—材料科学与工程] TG292[金属学及工艺—金属材料]