弹性模量比对界面迁移下夹杂演化的影响  

THE EFFECT OF ELASTIC MODULUS RATIO ON INCLUSION EVOLUTION BY INTERFACE MIGRATION

作　　者：井亚彬 黄佩珍[1] JING Ya-bin;HUANG Pei-zhen(State Key Laboratory of Mechanics and Control of Mechanical Structures,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机械结构力学及控制国家重点实验室,南京210016

出　　处：《工程力学》2020年第7期8-16,共9页Engineering Mechanics

基　　金：江苏省自然科学基金(BK20141407);江苏省高校优势学科建设工程资助项目。

摘　　要：集成电路的导线内不可避免存在夹杂等缺陷。在各种内在机制以及外界环境作用下夹杂会出现形态演化从而影响内连导线的各种性能。该文基于界面迁移机制下微结构演化理论,推导了应力诱发固-固界面迁移的单元控制方程,数值模拟了夹杂-基体弹性模量比对夹杂形态演化的影响。结果表明:不同模量比下夹杂的σ>σ_c、β>β_c或h<h_c时,夹杂长大;反之收缩。随着模量比的增加,临界应力、临界形态比随之增大,而临界线宽会减小。并且,当夹杂与基体的弹性模量比α>0.6时,模量比对于临界应力和临界形态比的影响可忽略。Defects such as inclusions are inevitably presented in the wires of integrated circuit.Under the effect of various internal mechanisms and external environment,the morphology evolution of the inclusions will affect the performance of the interconnects.Based on the weak statement of microstructure evolution for the interface migration,the governing equations of stress-induced solid-solid interface migration are derived,and the effects of the Young’s modulus ratio of the inclusion and the matrix on the morphology evolution of inclusion are numerically simulated.The results show that:there are two kinds of bifurcation trends in the morphology evolution of the inclusions,and exist the critical stressσ_c,the critical aspect ratioβ_c and the critical line width h_c.h<h_c,the inclusion grows.Otherwise,the inclusion will shrink.As the modulus ratio increases,the critical stress or the critical aspect ratio increases,and the critical linewidth decreases.Also,when the Young’s modulus ratio of the inclusion to the matrix a>0.6,stress and the critical aspect ratio can be ignored.

关 键 词：夹杂 模量比 有限单元法 应力 界面迁移 

分 类 号：TN405[电子电信—微电子学与固体电子学]