环氧树脂胶粘剂的固化模型、工艺设计以及试验验证  

Curing model,process design and test verification of epoxy resin adhesive

作　　者：何端鹏 高鸿[1] 于翔天[1] 邢焰[1] 王向轲[1] He Duanpeng;Gao Hong;Yu Xiangtian;Xing Yan;Wang Xiangke(China Aerospace Components Engineering Center,Beijing 100094,China)

机构地区：[1]中国航天宇航元器件工程中心,北京100094

出　　处：《中国胶粘剂》2020年第6期11-16,共6页China Adhesives

基　　金：中国航天宇航元器件工程中心青年基金项目。

摘　　要：采用非等温DSC法对环氧树脂胶粘剂的固化动力学进行了研究,利用Kissinger模型计算得到体系固化反应的表观活化能为91.2 kJ·mol-1,通过Crane模型计算出固化反应级数为0.93。基于动力学参数,构建出体系固化度与温度、时间关系的固化模型。利用"T-β"及"t-β"外推法分析,获得了体系固化反应温度及固化时间,并试验验证了固化工艺参数的有效性。该研究成果可为环氧树脂胶粘剂的固化工艺及应用提供理论指导和参考。The curing kinetics of epoxy resin adhesive was studied by non-isothermal DSC method.The apparent activation energy of curing reaction was 91.2 kJ/mol calculated by Kissinger model,and the curing reaction order was 0.93 calculated by Crane model.Based on the kinetic parameters,the curing model of curing degree with temperature and time was established.Using the"T-β"and"t-β"extrapolation method analysis,the curing reaction temperature and curing time of the system was obtained,and the effectiveness of the curing process parameters was verified by test.The research results could provide theoretical guidance and reference for the curing process and application of epoxy resin adhesive.

关 键 词：环氧树脂 胶粘剂 固化度 固化温度 固化时间 

分 类 号：TB433.4[一般工业技术]