26GHz波段毫米波放大器空气腔型封装设计  

Design of an Air-Cavity Package for 26 GHz Millimeter Wave Amplifier

作　　者：张晓朋 吴兰 高博 邢浦旭[1,2] 崔培水 谷江 Zhang Xiaopeng;Wu Lan;Gao Bo;Xing Puxu;Cui Peishui;Gu Jiang(North-China Integrated Circuit Co.,Ltd,Shijiazhuang 050200,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China)

机构地区：[1]河北新华北集成电路有限公司,石家庄050200 [2]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2020年第7期550-556,570,共8页Semiconductor Technology

基　　金：国家科技重大专项资助项目(2017ZX030121010)。

摘　　要：针对毫米波频段放大器芯片,提出了一种基于有机封装基板和液晶聚合物盖帽的空气腔型封装结构,解决了塑封器件在毫米波频段阻抗失配、插入损耗大和热阻高等问题,且降低了封装成本。通过电磁场仿真,优化了封装管脚在毫米波频段的阻抗特性,降低了射频管脚的阻抗失配,优化了芯片焊盘与封装基板之间的键合方案,降低了封装整体的插入损耗。采用条状通孔和基板减薄方法,降低了封装结构的热阻。在24~30 GHz,封装芯片小信号增益达到21 dB,饱和输出功率达到26 dBm。与裸芯片相比,封装芯片的饱和输出功率仅损失了1 dB。芯片封装后的整体热阻为28℃/W,满足芯片可靠性应用的需求。An air-cavity package structure based on organic package substrates and liquid crystal polymer caps for millimeter wave amplifier chips was proposed, which solved the problems of impedance mismatch, large insertion loss and high thermal resistance of plastic package devices in the millimeter wave band, and reduced package cost. Through electromagnetic field simulation, the impedance characteristics of package pins in the millimeter wave band were optimized,the impedance mismatch of RF pins was reduced, the bonding scheme between the chip pad and the package substrate was optimized, and the overall insertion loss of the package was reduced. The bar-vias and substrate thinning were used to reduce the thermal resistance of the package structure. The packaged chip has a small signal gain of 21 dB and a saturated output power of 26 dBm in 24-30 GHz. Compared with the bare chip, the saturated output power of the packaged chip losts only 1 dB. The total thermal resistance of the packaged chip is 28 ℃/W, which meets the needs of chip reliability applications.

关 键 词：毫米波芯片 空气腔型封装 低损耗封装 低成本封装 液晶聚合物 

分 类 号：TN305.94[电子电信—物理电子学]