Heat Transfer Performance of Microgroove Back Plate Heat Pipes with Working Fluid and Heating Power  

作　　者：WU Yanpeng JIA Jie TIAN Dongmin CHUAH Yew Khoy 

机构地区：[1]Department of Building Environment and Energy Engineering,University of Science and Technology Beijing,Beijing 100083,China [2]Department of Energy and Refrigerating Air Conditioning Engineering,Taipei University of Technology,Taipei 10608,China

出　　处：《Journal of Thermal Science》2020年第4期982-991,共10页热科学学报（英文版）

基　　金：financial support for this research through the Beijing Natural Science Foundation(No.8202034);the USTB-NTUT Joint Research Program.

摘　　要：Micro heat pipes(MHP) cooling is one of the most efficient solutions to radiate heat for high heat flux electronic components in data centers. It is necessary to improve heat transfer performance of microgroove back plate heat pipes. This paper discusses about influence on thermal resistance through experiments and numerical simulation with different working fluids, filling ratio and heat power. Thermal resistance of the CO2 filled heat pipe is 14.8% lower than the acetone filled heat pipe. In the meantime, at the best filling ratio of 40%, the CO2 filled heat pipe has the optimal heat transfer behavior with the smallest thermal resistance of 0.123 K/W. The thermal resistance continues to decline but the magnitude of decreases is going to be minor. In addition, this paper illustrates methods about how to enhance heat pipe performance from working fluids, filling ratio and heat power, which provides a theoretical basis for practical applications.

关 键 词：microgroove back plate heat pipes working fluids filling ratio heat power 

分 类 号：TK124[动力工程及工程热物理—工程热物理] TK172.4[动力工程及工程热物理—热能工程]