Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding  

作　　者：Jian Yang Zhang Bin Xu Naeemul Haq Tariq MingYue Sun DianZhong Li Yi Yi Li 

机构地区：[1]Key Laboratory of Nuclear Materials and Safety Assessment,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [2]School of Materials Science and Engineering,University of Science and Technology of China,Shenyang 110016,China [3]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [4]Department of Metallurgy and Materials Engineering,Pakistan Institute of Engineering and Applied Sciences,Nilore,Islamabad,Pakistan

出　　处：《Journal of Materials Science & Technology》2020年第11期1-11,共11页材料科学技术（英文版）

基　　金：the National Key Research and Development Program[grant number 2018YFA0702900];the National Natural Science Foundation of China[grant numbers U1508215,51774265];the National Science and Technology Major Project of China[Grant No.2019ZX06004010];the Key Program of the Chinese Academy of Sciences[Grant No.ZDRW-CN-2017-1];the CAS Interdisciplinary Innovation Team。

摘　　要：As an advanced solid state bonding process,plastic deformation bonding(PDB)is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling.In this study,PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions.It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization(DDRX)at 1000–1150℃.Electron backscattered diffraction(EBSD)and transmission electron microscopy(TEM)results revealed that the bonding of joints is related with interfacial grain boundary(IGB)bulging process,which is considered as a nucleation process of DRXed grain under different deformation environments.During recrystallization process,the bonded interface moved due to strain-induced boundary migration(SIBM)process.Stored energy difference(caused by accumulation of dislocations at the bonding interface)was the dominant factor for SIBM during DRX.The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB.

关 键 词：Isothermal compression bondingDynamic recrystallization Microstructures Grain boundary MISORIENTATION 

分 类 号：TG306[金属学及工艺—金属压力加工]