高敏感低电阻热双金属180R05的界面扩散研究  

Study on Interface Diffusion of Thermal Bimetal 180R05 with High Sensitivity and Low Resistivity

作　　者：谢东辉[1] 彭伟锋[1] 张静[1] 于敏[1] 蔡凯洪[1] 张荣[1] XieDonghui;Peng Weifeng;Zhang Jing;Yu Min;CaiKaihong;Zhang Rong(Beijing Beiye Functional Materials Corporation)

机构地区：[1]北京北冶功能材料有限公司

出　　处：《金属材料研究》2020年第2期35-40,24,共7页Research on Metallic Materials

摘　　要：采用冷轧复合工艺制备了高敏感低电阻热双金属180R05,研究了扩散退火温度和时间对180R05热双金属的界面扩散行为和性能的影响,对界面合金元素互扩散的规律进行了分析,推导出界面扩散层厚度随扩散退火温度和时间变化的关系式,并进行了扩散退火工艺试验验证,分析了剥离界面的微观形貌。结果表明:Mn72-Cu界面的扩散趋势明显大于Cu-Ni36界面,Mn72-Cu界面扩散层厚度的生长与扩散时间的平方根严和扩散温度T的e#的成正比,而Cu-Ni36界面扩散层厚度随退火温度和时间增加变化不大;Mn72-Cu界面关系式计算的扩散层厚度与实际测量值基本相符;采用高温短时扩散退火工艺能够显著降低Mn72-Cu界面扩散层厚度,提高热双金属的热敏特性,且界面结合牢固;Mn72-Cu界面和Cu-Ni36界面可实现良好的冶金结合。The thermal bimetal 180R05 with high sensitivity and low resistivity was prepared by cold rolling composite process,the influence of diffusion annealing temperature and time on the interface diffusion behavior and properties of 180R05 was studied.The law of the mutual diffusion of alloy elements in the interface was analyzed.The relationship between the thickness of diffusion layer and diffusion annealing temperature and time was deduced,and the diffusion annealing process test was carried out.The micro morphology of the interface was analyzed.The results show that the diffusion trend of Mn72-Cu interface is obviously larger than that of Cu-Ni36 interface,the growth of the diffusion layer thickness of Mn72-Cu interface is directly proportional to the square root t^1.2 of diffusion time and the e l T of diffusion temperature T,while the thickness of Cu-Ni36 interface diffusion layer does not change much with the increase of annealing temperature and time.The calculated diffusion layer thickness of Mn72-Cu interface relationship is basically consistent with the actual measured value.High temperature short-time diffusion annealing is adopted,the process can significantly reduce the thickness of the diffusion layer at the interface of Mn72-Cu,improve the thermal sensitivity of the thermal bimetal,and the interface bonding is firm;the interface of Mn72-Cu and Cu-Ni36 can achieve good metallurgical bonding.

关 键 词：热双金属 扩散退火 界面扩散 扩散层厚度 

分 类 号：TG1[金属学及工艺—金属学]