基于玻璃浆料键合的硅基漏孔封接工艺优化研究  

Bonding of Si-Based Vacuum Leaks with Glass-Frit Slurry: An Experimental and Simulation Study

作　　者：周问天 任国华[2] 孟冬辉[2] 孙立臣[2] 王旭迪[1] Zhou Wentian;Ren Guohua;Meng Donghui;Sun Lichen;Wang Xudi(Hefei University of Technology,Hefei 230009,China;Beijing Institute of Spacecraft Environment Engineering,Beijing 100094,China)

机构地区：[1]合肥工业大学机械工程学院,合肥230009 [2]北京卫星环境工程研究所,北京100094

出　　处：《真空科学与技术学报》2020年第6期514-518,共5页Chinese Journal of Vacuum Science and Technology

基　　金：国家自然科学基金面上项目(61574053,61871172)。

摘　　要：随着漏孔在超高真空计量应用的广泛需求,目前常用的Torr-Seal胶封接方法由于其高放气率而不再适用,迫切需要一种放气率低、气密性好的封接方法。本文提出了一种新的基于玻璃浆料键合的硅基漏孔封接方法,即利用玻璃浆料键合工艺将硅片封接到可伐管上,并通过法兰连接到真空测试系统中。研究优化了玻璃浆料的热调节工艺,并使用氦质谱检漏仪测量了封接组件的本底漏率。测量结果显示,在一个大气压的上游压力下测得的最小本底漏率为1.0×10-13 Pa·m3/s。采用仿真软件ANSYS对封接的降温阶段进行了热应力分析,根据仿真结果证明了可伐合金的优越性。We reported the total solution to a serious outgassing problem of Torr-Seal glue in bonding of Si-based leaks.The original work included glass-frit slurry and kovar-cup adaptor with a hole at the bottom.The thermal stress distribution in glazing/cooling of the bonding assembly,including the Si-wafer,glass-frit slurry and a kovar-cup or a 304 stainless steel cup,was simulated with ANSYS for optimization of the glazing/cooling conditions and for best matching the thermal expansion coefficients of materials involved.Moreover,the lowest background leak-rate of the bonding assembly was measured to be 1.0×10-13 Pa·m3/s with helium leak-detector.The results show that when it comes to bonding of Si-based leaks,glass-frit slurry outperforms Torr-Seal glue because of a much lower outgassing rate.We suggest that glass-frit bonding technique be of some technological interest in calibration of ultrahigh vacuum systems/devices/gauges.

关 键 词：漏孔 封接 玻璃浆料 可伐 热应力仿真 

分 类 号：TB77[一般工业技术—真空技术]