晶圆激光开槽工艺研究  

Study on Laser Grooving Technology of Wafer

作　　者：梅志鹏 岳永豪 田燕 牛昊 王凯[1] Mei Zhipeng;Yue Yonghao;Tian Yan;Niu Hao;Wang Kai(Xi′an Microelectronic Technology Institute,Xi'an,Shaanxi 710600,China)

机构地区：[1]西安微电子技术研究所,陕西西安710600

出　　处：《应用激光》2020年第2期276-282,共7页Applied Laser

基　　金：国家重点研发计划项目(项目编号:2017YFB0406400);陕西省重点研发计划项目(项目编号:2018ZDXM-GY-109)。

摘　　要：在半导体的制造过程中,为减少RC延时效应,其中作为绝缘层的low-k材料被广泛引入。由于low-k材料的强度低于二氧化硅,在芯片切割分离过程中,传统的刀具切割会产生分层现象。并且由于使用纯水作为切割水,会使得焊盘表面的金属层发生电化学腐蚀。为改善切割过程中上述因素对产品良率造成的影响,采用激光开槽与刀具划片相结合的切割工艺。本文主要探究激光开槽相关参数对开槽质量的影响,以获得高质量的满足后续刀具切割加工要求的晶圆。通过研究发现,影响开槽质量的参数主要包括:激光功率、激光频率、开槽速度,并且经过激光开槽后的晶圆在后续进行切割时会大大提高加工效率。In the integrated circuit manufacturing process, in order to reduce the RC delay effect, the low-k materials as insulating layer are widely used. Since the mechanical strength of the low-k materials is lower than that of the silicon dioxide, the conventional dicing saw can cause delamination. And because of the use of pure water for cutting, the aluminum pads are electrochemically corroded under the immersion and impact of the water flow. In order to reduce the influence of the above factors during the cutting process, a cutting process combining laser grooving and dicing is developed. This paper mainly explores the influence of related parameters on the quality of the laser groove to obtain the wafer that meets the requirements of subsequent dicing saw. The research found that the parameters affecting the quality of the groove mainly include: laser power, laser frequency, grooving speed, and the subsequent cutting processing efficiency will be greatly improved after laser grooving.

关 键 词：晶圆划片 激光开槽 low-k芯片 焊盘腐蚀 

分 类 号：TN305.1[电子电信—物理电子学]