双峰分布超细聚酰亚胺粉末的制备  

Preparation of Ultrafine Polyimide Powder with Bimodal Distribution

作　　者：姜海健[1] 苏桂明[1] 方雪[1] 陈明月[1] 崔向红[1] 张晓臣[1] 宋美慧[1] JIANG Haijian;SU Guiming;FANG Xue;CHEN Mingyue;CUI Xianghong;ZHANG Xiaochen;SONG Meihui(Functional Composites Engineering Research Center,Institute of Advanced Technology,Heilongjiang Academy of Sciences,Harbin 150028,China)

机构地区：[1]黑龙江省科学院高技术研究院,功能复合材料工程中心,黑龙江哈尔滨150028

出　　处：《绝缘材料》2020年第7期34-38,共5页Insulating Materials

摘　　要：为使聚酰亚胺(PI)材料可以使用选择性激光烧结(SLS)技术进行快速成型,根据SLS成型技术的耗材要求,以二苯醚四甲酸二酐(ODPA)、4,4′-二氨基二苯醚(ODA)为单体,设计并制备了醚酐型聚酰胺酸(PAA),使用溶液沉淀法制备出PI模塑粉,并通过两种亚胺化机理相配合的工艺调节模塑粉的粒径。对制得的产物进行了红外光谱分析、微观形貌分析、粒度分析以及热学性能分析。结果表明:PI模塑粉亚胺化完全,表面形貌近似球形或半球形,粒径分布集中于2μm以下或在2μm以下及30~40μm区间双峰分布,同时在350~360℃可熔融,完全可应用于SLS成型技术。In order to use selective laser sintering(SLS) technology to rapidly moulding the polyimide materials, according to the requirement of consumables in SLS, we designed and prepared an ether anhydride type polyamide acid(PAA) using 4,4′-oxydiphthalic dianhydride(ODPA) and 4,4′-diaminodiphenyl ether(ODA) as monomers. Then a PI moulding powder was prepared by solution precipitation method.The particle size distribution was adjusted through the combination process of two imidization mechanisms, and the PI powder was characterized by infrared spectroscopy, micro-morphology analysis, particle size analysis, and thermal performance analysis. The results show that the PI moulding power has complete imidization, its surface morphology is approximate spherical or hemispherical, and the particle size concentrates below 2 μm or forms a bimodal distribution below 2 μm and in 30-40 μm. The PI powder could melt at 350-360 ℃, so it can be applied in SLS moulding technology completely.

关 键 词：聚酰亚胺模塑粉 组合亚胺化 双峰粒径分布 SLS成型技术 

分 类 号：TM215[一般工业技术—材料科学与工程]