超声对Ni/Sn固-液溶解行为的影响  

Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn

作　　者：刘赟[1] 俞伟元[1] 孙军刚 孙学敏[1] 王锋锋 Liu Yun;Yu Weiyuan;Sun Jungang;Sun Xuemin;Wang Fengfeng(State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou University of Technology,Lanzhou 730050,China)

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州730050

出　　处：《稀有金属材料与工程》2020年第7期2365-2371,共7页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51465032)。

摘　　要：采用浸入实验法对比研究了加载超声和无超声辅助下Ni在Sn中的溶解动力学,通过模拟探明了熔池中声压分布规律,观察了Ni-Sn界面微观组织。上述研究表明,超声作用10 s Ni丝的溶解量与不加超声保温5 min的溶解量相当,表明超声能促进Ni在熔融Sn钎料中的溶解。无超声辅助时,随着保温时间的增加,Ni-Sn界面金属间化合物逐渐增厚,阻碍了Ni与Sn之间的相互扩散;而在超声空化作用下,Ni-Sn界面处于动态非平衡状态,能促进Ni在液态Sn中不断溶解;同时,在超声声流作用下界面Ni原子快速迁移至Sn中,在随后的冷却过程中析出大量细长棒状的Ni3Sn4金属间化合物。The dissolution behavior of Ni in molten Sn solder with and without applied ultrasonic vibration(USV)was investigated by the immersion experiment.In order to reveal the mechanism of accelerated dissolution by USV,the ultrasonic pressure distribution in molten solder was simulated by finite element analysis and the microstructures after dissolution were observed.The results show the dissolution amount of Ni in Sn after 10 s of USV is equivalent to that of a holding time of 5 min without USV.Without USV,the interfacial IMC gradually thicken as the holding time increases,which hinders the diffusion of Ni atoms into the Sn solder.With USV,ultrasonic cavitation causes the infinite dissolution of Ni into Sn solder.Furthermore,the dissolved Ni atom at the interface is brought rapidly to the molten solder by the ultrasonic streaming,which causes a large number of elongated rod-shaped Ni3Sn4 precipitated during the subsequent cooling process.

关 键 词：溶解 激活能 超声空化 超声辅助钎焊 

分 类 号：TG454[金属学及工艺—焊接]