加成型导热硅凝胶密着力的研究  

Study on Adhesion of Additional Thermal Conductive Silicone Gel

作　　者：黄琪 刘光华 黄文哲 陈建军 黄恒超 HUANG Qi;LIU Guang-hua;HUANG Wen-zhe;CHEN Jian-jun;HUANG Heng-chao(Guangzhou Baiyun Chemical Industry Co.,Ltd.,Guangdong Guangzhou 510540,China)

机构地区：[1]广州市白云化工实业有限公司,广东广州510540

出　　处：《广州化工》2020年第15期106-108,共3页GuangZhou Chemical Industry

摘　　要：以α,ω-二乙烯基硅油为基础聚合物,含氢硅油为交联剂,Al2O3为导热填料制备加成型导热硅凝胶,研究了α,ω-二乙烯基硅油粘度大小、含氢硅油活性氢含量、n(Si-H)/n(Si-Vi)比值、导热填料的添加量对于导热硅凝胶密着力的影响。结果表明,随着α,ω-二乙烯基硅油粘度、含氢硅油氢含量、n(Si-H)/n(Si-Vi)比值、导热填料的添加量的提高,密着力呈现先变大后变小的趋势。The additional thermal conductive silicone gel was prepared by usingα,ω-divinyl polydimethyl siloxane as the basic polymer,hydrogen-containing silicone oil as crosslinker and Al2O3 as thermal conductive filler.The effects of the viscosity ofα,ω-divinyl polydimethyl siloxane,the hydrogen content of hydrogenated silicone oil,n(Si-H)/n(Si-Vi)ratio and the content of thermal conductive filler on the adhesive force of thermal conductive silicone gel were studied.The results showed that with the increasing of viscosity ofα,ω-divinyl polydimethyl siloxane,hydrogen content of hydrogen containing silicone oil,n(Si-H)/N(Si VI)ratio and content of thermal conductive filler,the adhesive force firstly increased and then decreased.

关 键 词：加成型 导热 硅凝胶 密着力 

分 类 号：TQ433.438[化学工程]