有机脲固化环氧树脂行为研究  

Curing Behavior of Organic Urea/Epoxy Resin System

作　　者：丁昕韵 张晓雅 朱康 高菁菁 王炳强 蔡计杰 孙昊 孙莺[1] 胡和丰[1] DING Xin-yun;ZHANG Xiao-ya;ZHU Kang;GAO Jing-jing;WANG Bing-qiang;CAI Ji-jie;SUN Hao;SUN Ying;HU He-feng(School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;Shanghai Cedar Composites Technology Co.Ltd.,Shanghai 201306,China)

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]上海晋飞碳纤科技股份有限公司,上海201306

出　　处：《合成材料老化与应用》2020年第4期54-56,共3页Synthetic Materials Aging and Application

摘　　要：采用非等温差示扫描量热法研究了有机脲/环氧树脂体系的固化反应的动力学。用Kissinger动力学模型计算得到该体系固化反应的表观活化能为58.1 kJ/mol,指前因子为5.83×10^6 min^-1。通过Crane模型得出固化反应级数n为0.884,表明有机脲/环氧树脂体系的固化反应属于复杂反应。根据特征温度-升温速率外推法,得到前固化温度为110℃,固化温度为130℃,后固化温度为150℃。在实际应用中,为确定有机脲/环氧树脂体系的固化工艺提供参考。The curing kinetics of organic urea/epoxy resin system was studied by non-isothermal DSC method.The apparent activation energy of the curing reaction and pre-exponential factor calculated by Kissinger kinetics model was 58.1 kJ/mol,and 5.83×10^6 min^-1,respectively.The curing reaction order n was 0.884 by the Crane model,indicating that the curing reaction of the organic urea/epoxy resin system was a complex reaction.According to characteristic temperature-heating rate extrapolation method,we obtained that precuring temperature was 110℃,curing temperature was 130℃,and post-curing temperature was 150℃.In practical application,it provided a reference for determining the curing process of organic urea/epoxy resin system.

关 键 词：有机脲 环氧树脂 固化动力学 非等温DSC 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]