镀金触点接触电阻与压力载荷关系的试验研究  

Experimental Investigation of the Relationship between the Contact Resistance and Contact Load for Gold Plated Contacts

作　　者：杜庆丰 张超[1] 王国涛[2] 任万滨[1] DU Qingfeng;ZHANG Chao;WANG Guotao;REN Wanbin(School of Electrical Engineering and Automation,Harbin Institute of Technology,Harbin 150001,China;School of Electronic Engineering,Heilongjiang University,Harbin,150080,China)

机构地区：[1]哈尔滨工业大学电气工程及自动化学院,哈尔滨150001 [2]黑龙江大学电子工程学院,哈尔滨150080

出　　处：《电工材料》2020年第4期3-6,共4页Electrical Engineering Materials

基　　金：国家自然科学基金项目(51777039);黑龙江省教育厅省属高校科技成果研发培育项目(TSTAU-C2018016)。

摘　　要：微型继电器内触点间的电接触性能是决定其稳定可靠工作的关键。应用接触电阻原位测试分析系统,试验测试了镀金触点在0~100 mN接触压力下的接触电阻曲线。根据接触电阻与接触压力的关系Rc=KcF-m,将电接触过程分为不稳定接触阶段、微凸单体接触阶段、过渡接触阶段和稳定接触阶段。进一步地,提出了粗糙表面多微凸体接触模型,阐释了过渡接触阶段接触电阻的抖降现象。本研究对于微型继电器接触电阻影响因素的确定以及有效控制具有参考价值。The electrical contact issuesare critical to the stable performance and reliability of micro-electromechanical-relays.In this paper,the contact resistance of gold plated contacts is investigated experimentally under the contact load of 100 mN by the contact resistance test system in-situ.And the contact resistance behavior is characterized by four stages,that is,the unstable contact stage,the single asperity contact stage,the transition contact stage and the stable contact stage according to the power law for contact resistance versus contact force Rc=KcF-m.Furthermore,a multi-asperities model with rough surface is introduced to explain the intermittently sharp decrease of contact resistance in the transition contact stage.This research work is valuable for determining the influence factors and the effective control method for micro-electromechanical-relays.

关 键 词：电接触 镀金触点 接触电阻 粗糙表面 接触压力 

分 类 号：TM58[电气工程—电器]