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作 者:江家豪 解晓宇 潘泰松[1] JIANG Jiahao;XIE Xiaoyu;PAN Taisong(State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China)
机构地区:[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054
出 处:《电子元件与材料》2020年第8期13-18,共6页Electronic Components And Materials
基 金:国家自然科学基金(61901085)。
摘 要:通过在聚二甲基硅烷(PDMS)基底中嵌入填充GaIn液态合金的微型腔体结构,设计并制备了一种柔性多点温度传感器件。结合红外热成像表征结果和基于热扩散系数的理论分析,讨论了填充GaIn合金的腔体在嵌入PDMS基底后对器件中热量传导行为的影响。实验表征和理论分析表明,由于GaIn合金的热扩散系数远高于PDMS,腔体结构的引入可有效缩短器件的热响应时间。此外通过对器件各测温单元的电阻-温度曲线表征和弯曲对比实验,也展示了器件良好的线性响应特性、空间分辨率和测温位置稳定性。By embedding the cavity structures filled with liquid GaIn alloy in the polydimethylsiloxane(PDMS)substrate,a flexible multi-point temperature sensor is designed and fabricated.Based on the infrared imaging results and the theoretical analysis,the effects of the cavity filled with liquid GaIn alloy on the thermal transport in the device substrate were discussed.The experimental and theoretical analyses indicate that the adoption of cavity in the substrate can significantly shorten the thermal response time of the sensor due to the higher thermal diffusivity of GaIn alloy.Moreover,other features of the sensor,including the linearity,spatial resolution and the stability of the sensing position in the deformed device,are also demonstrated by the measured temperature dependence of the resistance of the sensor and the comparison of the deformation states of the bent sensors.
关 键 词:柔性电子 温度传感器 腔体结构 GaIn合金 热扩散系数
分 类 号:TP212[自动化与计算机技术—检测技术与自动化装置]
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