热浸镀工艺对SnAgCu镀层组织和Cu6Sn5化合物生长的影响  

Effect of hot dip process on microstructure of SnAgCu coating and growth of Cu6Sn5 compound

作　　者：朱宏喜[1,2] 田保红 张毅[1,2] 任凤章 李全安[1,2] 王胜刚 ZHU Hong-xi;TIAN Bao-hong;ZHANG Yi;REN Feng-zhang;LI Quan-an;WANG Sheng-gang(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Collaborative Innovation Center of Nonferrous Metals,Henan Province,Luoyang 471023,China;Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]有色金属共性技术河南省协同创新中心,河南洛阳471023 [3]中国科学院金属研究所,辽宁沈阳110016

出　　处：《材料热处理学报》2020年第8期135-140,共6页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(U1704143);河南省科技开放合作项目(172106000058)。

摘　　要：研究了不同工艺条件下在C194铜合金表面热浸镀SnAgCu镀层的组织和金属间化合物(IMC)Cu6Sn5的形成过程。结果表明,镀层中存在Sn、Ag3Sn和Cu6Sn53种相。镀层的外层组织为富Sn层,内层组织为IMC层,富Sn层由网格状的初生相β-Sn和分布在网格空隙间的共晶组织组成,在Cu6Sn5化合物层中存在一些开放型和封闭型的孔隙。Cu6Sn5固相在生长过程中存在取向选择生长。热浸镀温度为260℃和280℃时,IMC层形成了不同的组织结构。IMC层中的“锯身”部分是在升温和保温过程中形成的,晶粒主要是横向生长,此阶段Cu6Sn5固相生长主要是由熟化扩散通量控制的,“锯齿”部分是在镀层降温过程中形成的,晶粒主要是纵向生长,此阶段Cu6Sn5固相生长主要是由取向选择生长控制的。Microstructure and the formation of intermetallic compound(IMC)Cu6Sn5of SnAgCu coating prepared on the surface of C194 copper alloy by hot dip process were studied.The results show that there are three phases of Sn,Ag3Sn and Cu6Sn5 in the coating.The outer structure of the coating is Sn-rich layer,and the inner structure is IMC layer.The Sn-rich layer is composed of grid-like primary phaseβ-Sn and eutectic structure distributed between grid voids.There are some open and closed pores in the Cu6Sn5 IMC layer.The Cu6Sn5 solid phase has orientation selective growth during growth.When the hot dip plating temperature is 260℃and 280℃,the IMC layer forms different microstructure.The“saw body”part in the IMC layer is formed during heating and heat preservation,the grains are mainly grown laterally,and the grain growth of the Cu6Sn5 is mainly controlled by the ripening diffusion flux.The“saw tooth”part is formed during coating cooling,the grains are mainly grown vertically,and the grain growth of the Cu6Sn5 is mainly controlled by the orientation selection growth.

关 键 词：热浸镀 SnAgCu镀层 Cu6Sn5 取向选择生长 

分 类 号：TG174.44[金属学及工艺—金属表面处理]