印制电路板设计的电磁兼容性分析  

EMC Analysis of PCB Design

作　　者：刘圣晓 LIU Shengxiao(Changhe Aircraft Industry(Group)Co.,Ltd.,Jingdezhen 333002)

机构地区：[1]昌河飞机工业(集团)有限责任公司,景德镇333002

出　　处：《现代制造技术与装备》2020年第7期122-123,共2页Modern Manufacturing Technology and Equipment

摘　　要：随着电子科学技术不断的发展,电子产品的种类和数量不断增加,功能方面也得到了一定优化,印制电路板的集成度问题也得到了相应完善。针对出现的电磁兼容性问题,应用调查资料及分析法对其进行相关的分析和研究。结果表明:研究的印制电路板的密度与电子产品的数量之间呈现正比例关系,可为相关人员带来一定的理论性支持和实践思考。With the continuous development of Electronic Science and technology,the variety and quantity of electronic products are increasing,the function has been optimized,and the integration of printed circuit board has also been improved.In view of the electromagnetic compatibility problems,the investigation data and analysis method are used to analyze and study the electromagnetic compatibility problems.The results show that:the density of printed circuit board and the number of electronic products present a positive proportional relationship,which can bring some theoretical support and practical thinking for relevant personnel.

关 键 词：印制电路板设计 电磁兼容性 地线网格 地线面 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN03