Ce含量对SnAg0.1Cu0.7无铅焊料合金性能的影响  

Effect of Ce Content on Properties of SnAg0.1Cu0.7 Lead-free Solder Alloy

作　　者：赵玲彦 滕媛 陈希 陈东东 卢红波[1] 严继康 白海龙[1,2] ZHAO Lingyan;TENG Yuan;CHEN Xi;CHEN Dongdong;LU Hongbo;YAN Jikang;BAI Hailong(Tin Products Manufacturing Co.,Ltd.,of YTCL,Kunming 650501,China;Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China)

机构地区：[1]云南锡业锡材有限公司,昆明650501 [2]昆明理工大学材料科学与工程学院,昆明650093

出　　处：《有色金属工程》2020年第9期25-29,共5页Nonferrous Metals Engineering

基　　金：云南省重大科技专项(2018ZE004)。

摘　　要：在SnAg0.1Cu0.7无铅焊料合金的基础上,添加Ce元素,研究Ce元素含量对合金微观组织、熔化特性、润湿性和拉伸性能的影响。按质量比将纯锡和中间合金SnCu10、SnAg3、SnCe1.8在270℃熔化,保温20 min,搅拌均匀后冷却(反复熔炼3次),制备成SnAg0.1Cu0.7Cex(x=0%、0.01%、0.05%、0.1%、0.2%)焊料合金。通过光学金相显微镜(OM)观察焊料合金的微观组织,通过差示扫描量热分析仪(DSC)表征焊料合金熔化特性,通过可焊性测试仪表征焊料的润湿性,采用万能材料试验机测试焊料合金的拉伸性能。结果表明:微量的Ce可细化组织,在Ce含量为0.01%时,组织最为细化均匀;液相线温度和熔程随着Ce含量的增加先减小后增大;随着Ce含量的增加润湿时间ta先减小后增大,最大润湿力Fmax呈下降趋势,在Ce含量为0.01%时,合金综合润湿性能最佳;Ce含量为0.05%时,抗拉强度最大。On the basis of SnAg0.1Cu0.7 lead-free solder alloy,the effects of Ce contents on microstructure,melting characteristics,wettability and tensile properties of the solder alloy were investigated.SnAg0.1Cu0.7Cex(x=0%,0.01%,0.05%,0.1%,0.2%)solder alloys were prepared by melting pure tin and intermediate alloys SnCu10,SnAg3,SnCe1.8 at 270℃,holding for 20 min,stirring evenly and cooling(repeated melting for 3 times).The microstructure of solder alloys was observed by optical microscope(OM),the melting characteristic of solder alloys was characterized by differential scanning calorimetry(DSC),the wettability of solder was measured by solderability tester,and the tensile property of solder alloy was tested by universal material tester.The results show that the microstructure can be refined by trace amount of Ce.When the content of Ce is 0.01%,the microstructure is the most refined and uniform;the liquidus temperature and melting range decreases firstly and then increases with the increase of Ce content;when the content of Ce increases,wetting time ta decreases firstly and then increases,maximum wetting force(Fmax)decreases,and when the content of Ce is 0.01%,the comprehensive wettability of the alloy is optimal;when the content of Ce is 0.05%,the tensile strength is the maximum.

关 键 词：SnAg0.1Cu0.7 CE 润湿性 微观组织 

分 类 号：TG425[金属学及工艺—焊接]