DNA origami mediated electrically connected metal–semiconductor junctions  

作　　者：Basu R.Aryal Dulashani R.Ranasinghe Tyler R.Westover Diana G.Calvopia Robert C.Davis John N.Harb Adam T.Woolley 

机构地区：[1]Department of Chemistry and Biochemistry,Brigham Young University,Provo,UT 84602,USA [2]Department of Chemical Engineering,Brigham Young University,Provo,UT 84602,USA [3]Department of Physics and Astronomy,Brigham Young University,Provo,UT 84602,USA

出　　处：《Nano Research》2020年第5期1419-1426,共8页纳米研究（英文版）

基　　金：We thank the National Science Foundation(No.1562729)and BYUs Simmons Research Endowment for support of this work.B.R.A.acknowledges the BYU Department of Chemistry and Biochemistry for a Roland K.Robins Graduate Research Fellowship.

摘　　要：DNA-based nanofabrication of inorganic nanostructures has potential application in electronics,catalysis,and plasmonics.Previous DNA metallization has generated conductive DNA-assembled nanostructures;however,the use of semiconductors and the development of well-connected nanoscale metal-semiconductor junctions on DNA nanostructures are still at an early stage.Herein,we report the first fabrication of multiple electrically connected metal-semiconductor junctions on individual DNA origami by location-specific binding of gold and tellurium nanorods.Nanorod attachment to DNA origami was via DNA hybridization for Au and by electrostatic interaction for Te.Electroless gold plating was used to create nanoscale metal-semiconductor interfaces by filling the gaps between Au and Te nanorods.Two-point electrical characterization indicated that the Au-Te-Au junctions were electrically connected,with current-voltage properties consistent with a Schottky junction.DNA-based nanofabrication of metal-semiconductor junctions opens up potential opportunities in nanoelectronics,demonstrating the power of this bottom-up approach.

关 键 词：current-voltage measurement DNA nanofabrication electroless plating gold nanorods nanoelectronics tellurium nanorods 

分 类 号：TB33[一般工业技术—材料科学与工程]