MEMS惯性导航微系统封装技术发展趋势  

Packaging Technology Development Trend of MEMS Inertial Navigation Microsystem

作　　者：沈时俊[1] 游超 庄永河[1] SHEN Shi-jun;YOU Chao;ZHUANG Yong-he(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2020年第1期1-4,共4页Hybrid Microelectronics Technology

摘　　要：随着智能微型武器对超小型MEMS惯性导航微系统的需求,DARPA不惜投入巨资开展微型惯性测量单元(MIMU)的研制,使惯性导航系统具有更高的集成度、更小的体积、更低的功耗和更低的成本。本文通过介绍MEMS惯性导航微系统三维集成技术、系统架构设计和TSV垂直互连技术,大幅提高了系统集成度,是未来MEMS惯性导航系统三维集成的主要路径。With the demand for ultra-small MEMS inertial navigation micro-systems by smart micro-weapons,DARPA has invested heavily in the development of a micro-inertial measurement unit(MIMU),which makes the inertial navigation system higher integration,smaller size,and lower power consumption and lower cost.This article introduces the three-dimensional integration technology,system architecture design and TSV vertical interconnection technology of MEMS inertial navigation microsystems,which greatly improves the system integration and is the main path for the future 3D integration of MEMS inertial navigation systems.

关 键 词：MEMS惯性导航微系统 微型惯性测量单元 三维集成技术 

分 类 号：TN964.1[电子电信—信号与信息处理] TN405[电子电信—信息与通信工程]