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作 者:杨靖鑫[1,2] 吴申立 丁小聪[1,2] 董兆文 麻茂生 YANG Jingxin;WU Shen-li;DING Xiao-cong;DONG Zhao-wen;MA Mao-sheng(No.43rd Research Institute of CETC,Hefei 230088,China;Anhui Province Technical Standard Innovation Base,Hefei 230001;Instruments’Center for Physical Science,University of Science and Technology of China,Hefei 230026,China)
机构地区:[1]中国电子科技集团公司第四十三研究所,合肥230022 [2]安徽省技术标准创新基地,合肥230001 [3]中国科学技术大学理化科学实验中心,合肥230026
出 处:《混合微电子技术》2020年第1期75-80,共6页Hybrid Microelectronics Technology
摘 要:本文主要针对LTCC微带滤波器电气连通率较低的问题进行了相关研究。通过比较,发现自制的LTCC微带滤波器端口导带露出端偏薄,从而导致在端口印上导带之后与中间层导带在端口处的电气连接性能不佳。通过进一步的分析,发现导致滤波器端口导带过薄的原因有两个:一、生瓷切片时刀口的带瓷;二、烧结过程中导体浆料与瓷体材料的收缩率不一致导致导体内缩。文章最后,针对性的提出了相应的改进措施,获得了最优化的工艺技术方案。This paper mainly studies the problem of low electrical connection rate of the LTCC filter.By comparison,The selfmade LTCC filter has a thin side at the exposed end of the tape,which results in poor electrical connection with the intermediate layer conduction band at the port after the conductor is printed on the side.Through further research and analysis,It is found that there are two reasons why the side conduction band of the LTCC filter is too thin.The first factor is that the edge of the porcelain is sliced with porcelain,and the second factor is that the shrinkage of the conductor pastes and the ceramic material during the sintering process is inconsistent,which causes the conductor to be indented inside.Finally,the corresponding improvement measures are proposed in a targeted manner,and the optimized process technology solution is obtained.
分 类 号:TN713.3[电子电信—电路与系统]
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