电子冷却件用铝合金的真空钎焊试验  

Vacuum brazing experiment of aluminum-alloy used for electronic cooling parts

作　　者：王丽七[1] 张群 曹国光 WANG Li-qi;ZHANG Qun;CAO Guo-guang(Anhui Vocational College of Defense Technology,Lu′an 237011 China;Bowei Chang an Electronic Co Ltd of Anhui Province,Lu′an 237000 China)

机构地区：[1]安徽国防科技职业学院,安徽六安237011 [2]安徽省博微长安电子有限公司,安徽六安237000

出　　处：《新余学院学报》2020年第4期23-26,共4页Journal of Xinyu University

基　　金：安徽省自然科学研究项目“6063铝合金电子元件冷却箱的真空钎焊与界面分析”(KJ2018A0892)。

摘　　要：采取化学清洗+超声波清洗、梯度式升温、添加适量镁屑为钎剂的措施,对6063-T6和3A21-H112铝合金进行了真空钎焊工艺探究。制作多组焊接工艺试件,对不同钎焊条件下工艺试件进行了外观检查、钎着率检测、金相检验、剪切强度测试。结果表明,添加20克和40克镁屑的试样在600℃钎焊效果较好,焊缝与基体结合良好,外观圆滑,不存在夹杂、裂纹、空洞缺陷,钎着率均在92%以上,力学性能满足电子冷却件的使用需求;未添加镁屑的试样在相同工艺条件下,成型效果差。The vacuum brazing experiments of 6063-T6 and 3A21-H112 aluminum-alloy were carried out by means of chemical cleaning&ultrasonic cleaning,gradient heating and adding Mg chips as brazing agent.The appearance inspection,brazing rate inspection,metallographic inspection and shearing test were carried out on the test pieces with different brazing conditions.The results showed that specimens brazed at 600℃with 20g and 40g Mg chips were better,that the seams were well combined with the matrix with no inclusion,crack and void defect,that the brazed rates were all higher than 92%,that the mechanical properties could meet the demand of electronic cooling parts and that teh test pieces with addition of Mg chips was poor in the shaping effect under teh same process condition.

关 键 词：铝合金 钎焊 梯度式加热 钎着率 

分 类 号：TG454[金属学及工艺—焊接]