Microstructure evolution of Ti5Si3 in Cu-Ti-Si alloys  

作　　者：Qing Liu Xiao-cui Zhang Qiang Wang Wen-zhi Miao Chun-yan Li Hai-min Ding 

机构地区：[1]School of Energy,Power and Mechanical Engineering,North China Electric Power University,Baoding 071003,China [2]State Grid Shandong Electric Power Maintenance Company,Jinan 250021,China [3]Hebei Key Laboratory of Electric Machinery Health Maintenance&Failure Prevention,North China Electric Power University,Baoding 071003,China

出　　处：《China Foundry》2020年第4期286-292,共7页中国铸造（英文版）

基　　金：This work was financially supported by the Natural Science Foundation of Hebei Province of China(Grant No.E2019502057);the Fundamental Research Funds for the Central Universities,China(Grant No.2018MS120).

摘　　要：The Cu-Ti-Si alloys containing in-situ formed Ti5Si3 are prepared. In order to clarify the Ti5Si3 formation processes and its microstructure characteristics, the as-cast and deeply etched Cu-Ti-Si alloys with different compositions and cooling rates were investigated using scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD). It is found that the eutectic Ti5Si3 phases in Cu-Ti-Si alloys are rod-like with hexagonal cross section which tend to intertwine with each other to form a firm skeleton like a bird nest structure which can make the alloys keep their original shape even after etching off the Cu matrix. In addition, there is Cu in the center of many Ti5Si3 rods, resulting in a core-shell structure. With the increase of the cooling rate, Ti5Si3 distributes more uniformly, and the diameter of Ti5Si3 significantly decreases, with a minimum size of less than 100 nm, while the aspect ratio of Ti5Si3 increases.

关 键 词：MICROSTRUCTURES Cu alloys TI5SI3 intermetallic compounds 

分 类 号：TG146.11[一般工业技术—材料科学与工程]