一种新型磁控溅射贵金属靶材设计  

Design of New Noble Metal Magnetron Sputtering Target

作　　者：樊涛 FAN Tao(Kotelisko(Shanghai)Trading Co.,Ltd.,Shanghai 201203,China)

机构地区：[1]科特莱思科(上海)商贸有限公司,上海201203

出　　处：《世界有色金属》2020年第12期288-291,共4页World Nonferrous Metals

摘　　要：通过Ansys有限元模拟传统圆形平面磁控溅射阴极的磁场排布,分析了直径为72mm圆形平面溅射阴极靶材利用率低的原因,模拟计算得到靶材表面水平方向Bx和By磁场分布数据,以此为依据设计一种新型的圆形平面溅射磁控靶材,采用塑料绑定的方式固定贵金属靶材和特殊结构铜背板,替代传统贵金属靶材结构。测试结果表明优化后的磁控溅射靶材在保证原磁控溅射靶材的利用率的情况下,减少贵金属材料占比80%,从而了降低贵金属靶材的成本。A traditional circular planar magnetron sputtering cathode magnetic field configuration was simulated by Ansys,and the reasons why low utilization rate of circular planar sputtering cathode target with diameter of 72 mm were analyzed,then magnetic field distribution of Bx and By in the horizontal direction of the target surface were calculated.On this data,a new type of circular planar magnetron sputtering target,which using plastic binding to fix precious metal target with special structure of copper back was designed.It is alternative to traditional precious metal target material structure.The results showed that the optimized magnetron sputtering target had the same utilization as the original magnetron sputtering target,but reduced the precious metal materials accounted for 80%.Thus,the cost of noble metal target material was reduced.

关 键 词：磁控溅射阴极 贵金属靶材 靶材绑定 橡胶粘合 Ansys磁场模拟 

分 类 号：TN86[电子电信—信息与通信工程]