电子浆料抗沉降技术研究进展  

Advances in settling resistance technologies of electronic pastes

作　　者：李燕华 左川[1] 王成 万甦伟 李俊鹏[1] LI Yanhua;ZUO Chuan;WANG Cheng;WAN Suwei;LI Junpeng(State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinμm Metals,Kunming Institute of Precious Metals,Kunming 650106,China)

机构地区：[1]昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,云南昆明650106

出　　处：《电子元件与材料》2020年第9期1-11,共11页Electronic Components And Materials

基　　金：云南省科技计划项目(2016DC032,2018ZE001)。

摘　　要：电子浆料作为电子元器件的主要功能材料被广泛应用于航空、计算机及通信等电子行业,主要由金属粉末、高分子树脂材料及其他助剂经机械力混合制成,存储过程中发生的物理沉降会影响浆料的使用性能。对电子浆料的沉降机制、悬浮体系下的沉降诱因以及如何提高电子浆料抗沉降性能进行综述。分析表明:导致沉降的主要机理包括重力沉降和分散稳定;影响电子浆料沉降的因素包括粉末颗粒的形貌、粒径、分布以及有机溶剂的特性;通过调节浆料粘度,加入表面活性剂、硅烷偶联剂、分散剂对粉末颗粒进行表面改性处理以及控制浆料的pH值可提升体系的分散稳定性,从而提高浆料抗沉降性能,延长浆料的使用寿命。Electronic slurry,the essential functional material for electronic components,is widely used in fields such as aviation,computation,communications and many other electronic industries.It is mainly composed of metal powder,polymer resin and other additives,which are homogenized by mechanical forces.The physical settlement of the stored slurry will affect their performance.This article reviews the mechanism of electronic slurry sedimentation,the inducement of sedimentation in suspension system,and the anti-sedimentation techniques of electronic slurry.The main mechanisms for electronic slurry settling include gravity settlement and dispersion instability,which could be affected by the morphology,particle size,distribution of powder particles and the properties of organic solvents.By adjusting the viscosity,modifying the particle surface with surfactants,silane coupling agents and dispersants,and controlling the pH value,one can improve the dispersion stability of the slurry to improve the anti-settling performance of electronic paste,which can extend the storage time of the slurry.

关 键 词：抗沉降 粉末颗粒 综述 电子浆料 流变性 粘度 

分 类 号：TM241[一般工业技术—材料科学与工程]