基于芯片产品的加速寿命试验研究综述  

The Research of Accelerated Life Test on Chip Products

作　　者：杨跃胜[1] 傅霖煌 武岳山[2] YANG Yue-sheng;FU Lin-huang;WU Yue-shan(Invengo Information Technology Co.,Ltd.)

机构地区：[1]深圳市远望谷信息技术股份有限公司芯片研发中心 [2]深圳市远望谷信息技术股份有限公司

出　　处：《中国集成电路》2020年第9期69-73,共5页China lntegrated Circuit

摘　　要：芯片产品寿命评估是芯片产业化应用中对产品质量的最基本的需求,文章介绍了加速寿命试验技术常用的外部应力类型,依据芯片加速寿命模型,分析了不同外部应力条件下的常见的四种加速因子的计算方法,并给出不同外部应力对应的加速因子暴露缺陷类型,对芯片及芯片产品寿命评估提供参考。The chip’s life assessment is the basic requirements for product quality in industrialization application.The commonly used external stress is introduced for the accelerated life technology type in this paper.Based on the chip accelerated life model,under different external stress conditions,the calculation methods of four acceleration factors are analyzed.And the defect type is given corresponding to different external stress accelerated factor.Finally,the reference for chip product life is provide in this paper.

关 键 词：集成电路 加速寿命试验 加速因子 可靠性试验 

分 类 号：TB114.3[理学—概率论与数理统计]