不同泡沫铜连接方式下相变温控组件接触热阻试验研究  

Experimental Study on Thermal Contact Resistance of Thermal Control Component under Different Copper Foam Connections

作　　者：苏欣 胡家渝[1] 李俞先 SU Xin;HU Jiayu;LI Yuxian(Southwest Institution of Electronic Technology, Chengdu 610036,China)

机构地区：[1]西南电子技术研究所,四川成都610036

出　　处：《机械与电子》2020年第9期13-16,共4页Machinery & Electronics

摘　　要：对相变温控组件内部的传热路径进行了定性分析,搭建了接触热阻试验平台,并对不同孔径泡沫铜与相变温控组件腔体之间的接触热阻进行了试验测试研究。结果表明:采用焊接或黏接方式能够有效提升相变温控组件样件的等效热导率,降低等效热阻;当泡沫铜孔径较小时,采用焊接方式的传热效果好于采用黏接方式,泡沫铜孔径较大时,两者的传热效果基本一致。A qualitative analysis on the heat transfer path of the thermal control component is given.Based on this,a thermal contact resistance test platform is built.On the platform,the thermal contact resistance between the thermal control component cavity and the copper foam of different porous were tested and calculated.The research results show that when adopt welding or bonding method,the equivalent thermal conductivity of the PCC will increase,and the equivalent thermal resistance will decrease at the same time.When the copper foam has the smaller porous,the heat transfer effect by welding method is better than bonding method.When the copper foam has the larger porous,the heat transfer effect by both method is almost the same.

关 键 词：相变温控组件 接触热阻 泡沫铜 

分 类 号：TK124[动力工程及工程热物理—工程热物理]