聚苯硫醚低介电改性的研究进展  

Research Progress in Low Dielectric Modification of Polyphenylene Sulfide

作　　者：钟绍信 蒋智杰[1] 朱亚明[1] 刘述梅[1] 赵建青[1] 范晓林 ZHONG Shaoxin;JIANG Zhijie;ZHU Yaming;LIU Shumei;ZHAO Jianqing;FAN Xiaolin(School of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China;Dongguan Jingu Plastic Technology Co.,Ltd.,Dongguan 523638,China)

机构地区：[1]华南理工大学材料科学与工程学院,广东广州510640 [2]东莞市金谷塑胶科技有限公司,广东东莞523638

出　　处：《绝缘材料》2020年第9期1-6,共6页Insulating Materials

摘　　要：本文综述了聚苯硫醚低介电改性的研究进展,包括采用玻纤增强、无机粒子填充、聚合物共混、引入空气微孔等方式改性聚苯硫醚,旨在保持聚苯硫醚优良综合性能的同时降低其介电常数和介质损耗,以期为其他热塑性工程塑料的低介电改性研究提供参考。The research progress in low dielectric modification of polyphenylene sulfide,including glass fiber reinforcing,inorganic particle filling,polymer blending,and introduction of air micropores,were reviewed,which aimed to maintain the excellent comprehensive properties of polyphenylene sulfide and reduce its dielectric constant and dielectric loss,so as to provide a reference for the low dielectric modification of other thermoplastic engineering plastics.

关 键 词：聚苯硫醚 低介电性能 塑料改性 

分 类 号：TM215[一般工业技术—材料科学与工程]