电铸低内应力Ni-Co合金实验研究  

Experimental Study on Electroforming of Ni-Co Alloy with Low Internal Stress

作　　者：张艳华 程鹏飞 孟凡净 张涛 武正权 ZHANG Yan-hua;CHENG Peng-fei;MENG Fan-jing;ZHANG Tao;WU Zheng-quan(School of Mechanical Engineering,Henan Institute of Technology,Xinxiang 453003,China)

机构地区：[1]河南工学院机械工程学院,河南新乡453003

出　　处：《河南工学院学报》2020年第4期21-27,共7页Journal of Henan Institute of Technology

基　　金：河南省青年骨干教师培养计划(2019GGJS265);河南省科技攻关项目(192102210211)。

摘　　要：为了解决Ni-Co合金铸层内应力难以控制的难题,研制出一种高性能添加剂TA,并评测了该添加剂的工艺效果,分析了电流密度和铸液pH等工艺参数对Ni-Co合金铸层性能的影响。实验结果表明,当添加剂TA的添加量为0.2 mL/L,电铸液pH=4,电铸液温度为55℃,阴极电流密度为2.OA/dm2时,能电铸出钴含量为16.2wt.%的高硬度(421.6 HV)、低内应力(6.4 MPa) Ni-Co合金铸层,并在此最优条件下制备出了高性能冷屏件。In order to solve the problem of internal stress control of Ni-Co alloys electroforming layer,a high-performance organic additive TA was developed.The process effect of the developed organic additive TA was evaluated.And the effects of process parameters includings current density and pH of electroforming solution on the performances of Ni-Co alloy electroforming layer.Experimental results show that high hardness(421.6 HV)and low internal stress(6.4 MPa) Ni-Co alloys electroforming layers with Co content of 16.2 wt.% can be electroformed when the additive amount of additive TA is 0.2 mL/L,pH of the electroforming solution is 4,temperature of the electroforming solution is 55℃ and the cathode current density is 2.0 A/dm2.And a high-performance cold-shield material was prepared under this optimal condition.

关 键 词：Ni-Co合金铸层 内应力 添加剂 冷屏件 

分 类 号：TQ153.4[化学工程—电化学工业]