板端连接端子波峰焊焊接传热研究  

Heat Transfer Analysis of Header Connector Wave Soldering Process

作　　者：李厚琨 王荣喜 王武军 毛建伟 杜金奎 尚亚强 LI Hou-kun;WANG Rong-xi;WANG Wu-jun;MAO Jian-wei;DU Jin-kui;SHANG Ya-qiang(Henan THB Electric Co.,Ltd.,Hebi 458030,China)

机构地区：[1]河南天海电器有限公司,河南鹤壁458030

出　　处：《汽车电器》2020年第9期49-52,共4页Auto Electric Parts

摘　　要：规格差异较大的端子在同一焊接过程实现良好焊接,对焊接工艺要求很高。研究规格差异较大的端子在波峰焊焊接工艺中的传热过程及差异性,从而改善端子设计减小传热差异性,实现良好焊接。通过对包含典型规格差异端子的PCB总成建立有限元模型,仿真波峰焊焊接传热过程。研究发现改善大规格端子设计,实现大规格端子与小规格端子温差缩小,升温滞后时间缩短,更易使大小规格端子同时实现良好焊接。The soldering technology requirements are very high to realize good soldering of terminals in different sizes.The research is about the heat transfer of wave soldering process and to find differences,so as to reduce the differential and achieve good soldering.The FEA model of PCB assembly containing typical terminals of different size is established to simulate the heat transfer of wave soldering.It is found that by improving the design of larger size terminals,the differential temperature between large size terminals and small size terminals can be reduced,and the lag time can be shortened,which makes it easier to achieve good soldering of all terminals in one soldering process.

关 键 词：有限元 端子 传热 波峰焊 

分 类 号：U463.62[机械工程—车辆工程]