微波组件馈电绝缘子与电路片穿焊结构研究  

Research on Penetration Welding Structure of Feed Insulator and Printed Circuit for Microwave Module

作　　者：何子均 尚俊 张聪聪 蒋苗苗 许冰 He Zi-jun;Shang Jun;Zhang Cong-cong;Jiang Miao-miao;Xu Bing(China Electronics Technology Corporation No.29 Research Institute,Sichuan Chengdu 610036)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子质量》2020年第9期39-42,共4页Electronics Quality

摘　　要：馈电绝缘子与电路片的电装穿焊工艺具有优良的可靠性,广泛应用于微波组件。然而,此种电装穿焊在工艺上存在一定概率的焊锡下漏,在馈电绝缘子玻珠之间形成焊锡多余物,焊锡多余物甚至导致馈电绝缘子中心导体与馈电绝缘子外壳之间短路。该文对馈电绝缘子与电路片穿焊结构的影响因素进行了正交试验,确定了最优结构方案,解决了微波组件馈电绝缘子与电路片穿焊焊锡下漏的问题。Because of the excellent reliability,the penetration welding electronics assembly for feed insulator and printed circuit is widely used in microwave modules.However,in the process there is a certain probability of solder leakage for the penetration welding electronics assembly.The solder on the insulator beads are just the remainder particles.The solder remainder particles maybe cause short circuit which is between the insulator center conductor and the insulator housing.In this paper,orthogonal experiments on the influencing factors of feed insulator and printed circuit for the penetration welding structure are carried out,the optimal structure scheme is determined,and the problem of solder leakage of the feed insulator and printed circuit for the microwave module is solved.

关 键 词：微波组件 馈电绝缘子 电装 焊锡下漏 

分 类 号：TN605[电子电信—电路与系统]