多层板孔内空洞缺陷的改善  

Improvement of void defects in holes of multilayer PCB

作　　者：张仁军 李波 杨海军 胡志强 Zhang Renjun;Li Bo;Yang Haijun;Hu Zhiqiang

机构地区：[1]四川英创力电子科技股份有限公司,四川遂宁629000

出　　处：《印制电路信息》2020年第9期34-38,共5页Printed Circuit Information

摘　　要：文章浅析的缺陷主要围绕我公司(一铜与二铜流程)之孔内空洞的几个大类进行分析与探讨。所谓孔内无铜,即导通孔内局部孔破或环状孔破,而现有传统的电测法对部分孔无铜难以检测,如漏至客户处将有潜在的风险。In this paper,several categories of holes in a company(electroless copper and graphics electroplating)are mainly analyzed and discussed.The main phenomenon of copper-free hole is local hole-breaking or ring holebreaking.The existing electrical testing methods cannot achieve 100%detection of this problem.If the defective product is leaked to the customer,there will be a big quality hazard.

关 键 词：孔内空洞 药水异常 特殊设计 过程控制 渐薄型 

分 类 号：TN41[电子电信—微电子学与固体电子学]