刚挠结合板激光孔偏位控制和研究  

Controlling and research on rigid-flex laser drilling shift issue

作　　者：何海洋 He Haiyang(Shanghai Meadville Electronics Co.,Ltd Shanghai 201613,China)

机构地区：[1]上海美维电子有限公司制造工程部,上海201613

出　　处：《印制电路信息》2020年第9期50-56,共7页Printed Circuit Information

摘　　要：微盲孔设计的刚挠结合印制电路板,由于聚酰亚胺基材在高温高压后的易形变的问题,以及越来越苛刻的圆环设计,导致了此类产品非常容易发生激光孔偏位的质量问题。文章在某任意层互联设计的刚挠结合板项目上,进行针对性的系统研究,通过列出导致激光孔偏位的可能原因,并安排DOE实验相应分析,最终得出针对激光孔偏位问题的有效控制方法。For rigid-flex PCB with HDI design,its base material polyimide easily got distortion after pressing process,and current products had more and more rigorous annual ring,and the two factors caused the laser drilling shift.This paper carried out systematic research on this issue based on one any-layer design rigid-flex,listed the possible causes and DOE experiment accordingly,finally got the effective controlling actions.

关 键 词：激光孔偏位 全制程特性化 变形 正交实验 

分 类 号：TN41[电子电信—微电子学与固体电子学]