熔注炸药低比压顺序凝固界面生长规律研究  

Effect of Solidification Temperature on Charge Density

作　　者：高丰 黄求安 王冠一 GAO Feng;HUANG Qiuan;WANG Guanyi(Automation Research Institute of China South Industries Group Corporation, Mianyang 621000, China;State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China)

机构地区：[1]中国兵器装备集团自动化研究所,四川绵阳621000 [2]北京理工大学爆炸科学与技术国家重点实验室,北京100081

出　　处：《兵器装备工程学报》2020年第8期126-130,共5页Journal of Ordnance Equipment Engineering

摘　　要：采用低比压顺序凝固装药技术,进行改B熔注炸药装药研究,建立熔注装药热传导有限元模型,模拟改B炸药凝固过程,预测炸药凝固界面变化、生长;通过实验得到改B炸药凝固成型时的温度场随时间的变化情况,动态研究炸药内部温度场及其变化规律,得到改B炸药低比压顺序凝固界面移动速度和生长规律,其结果与模拟结果吻合。A low specific pressure sequential solidification charging technology was used to study the modification of the B melt-charge explosive charge,and a finite element-based heat transfer model of the melt charge was simulated to simulate the change.The suspected solidification process of B explosives can predict the change and growth of the solidification interface.The temperature field of B explosives during solidification molding has been obtained through test experiments.During the process,the internal temperature field of explosives and its changing law and the moving speed of the solidification interface in order to change the low specific pressure of B explosive was obtained,and the solidification interface growth law was obtained.

关 键 词：弹药装药 低比压顺序凝固 凝固温度 界面生长 

分 类 号：TJ55[兵器科学与技术—军事化学与烟火技术]