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作 者:胡跃明[1,2] 李璐 罗家祥[1,2] HU Yueming;LI Lu;LUO Jiaxiang(College of Automation Science and Engineering,South China University of Technology,Guangzhou 510640,China;Engineering Research Center for Precision Electronic Manufacturing Equipment,Ministry of Education&Guangdong Provincial Engineering Laboratory for Advanced Chip Intelligent Packaging Equipment,South China University of Technology,Guangzhou 510640,China)
机构地区:[1]华南理工大学自动化科学与工程学院,广东广州510640 [2]精密电子制造装备教育部工程研究中心/广东省高端芯片智能封测装备工程实验室,广东广州510640
出 处:《计算机集成制造系统》2020年第9期2379-2387,共9页Computer Integrated Manufacturing Systems
基 金:国家自然科学基金资助项目(61573146);国家重大科技专项02专项资助项目(2014ZX02503);广东省应用型重大专项资助项目(2015B010133003);广州市南沙区技术攻关资助项目(2015GG004)。
摘 要:针对高密度超薄柔性集成电路基板精密检测需求,提出一种基于颜色特征的氧化缺陷检测算法。设计了一种基于局部直方图自适应阈值的铜箔表面快速分割方法,并给出一种基于单高斯模型(SGM)的二维颜色分割的氧化缺陷检测方法,提取氧化缺陷基于RGB、HSV与分块策略的8维颜色特征,输入有向无环图支持向量机(DAG-SVMS)分类器对氧化缺陷进行分级。实验表明,所提方法精度达到微米级别,最小可检测区域为15μm^2。为高密度超薄柔性集成电路基板制造过程提供了精密的表面缺陷检测系统,解决了铜箔表面氧化缺陷的自动检测难题。For the precision inspection requirement of high-density and ultra-thin flexible integrated circuit substrates,a detection method of oxidation defect was presented based on color characteristics.A fast segmentation method was designed for copper surface based on local histogram adaptive threshold.Then,a two-dimensional color segmentation method based on single Gauss model for detecting oxidation defects was proposed.An 8-dimensional color feature of oxidation defect was extracted based on RGB,HSV and block strategy,which input to the DAG-SVMS classifier to classify.The precision of method could reach micron level and the minimum detection area was 15μm 2.The proposed method provided a precise copper surface defect detection system for the manufacturing process of high-density and ultra-thin flexible integrated circuit substrate and solved the problem of automatic detection of oxidation defect on copper surface.
分 类 号:TP391.4[自动化与计算机技术—计算机应用技术]
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