低温固化无机密封剂的制备  

Preparation of Low Temperature Curing Inorganic Sealant

作　　者：董强 曹先启[1] 陈泽明[1] 李博弘[1] 韩爽[1] 王超[1] DONG Qiang;CAO Xian-qi;CHEN Ze-ming;LI Bo-hong;HAN Shuang;WANG Chao(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2020年第5期326-329,336,共5页Chemistry and Adhesion

摘　　要：以硅酸盐树脂作为主体,加入一定含量的无机填料,按比例混合后制备了一种可40℃固化的耐高温无机密封剂。通过力学性能测试、密封性测试、绝缘性测试、热失重分析(TG)、扫描电镜分析(SEM)、X射线衍射(XRD)等方法对密封剂性能进行表征。结果表明,密封剂对于钛合金、碳化硅及高温合金钢有良好的粘接性,室温及800℃剪切强度均大于4.5MPa;密封剂在0.5MPa起始气压下,压力下降10%时室温密封时间为900s,800℃时密封时间为370s;密封剂在500V外加电压下常温电阻大于500MΩ,在800℃时电阻值为2MΩ;TG显示密封剂800℃内总失重不足2%。The silicate is used as the matrix resin,a certain amount of inorganic filler is added as fillers,and a kind of high temperature resistant inorganic sealant which can be cured at 40℃is prepared according to the proportion.The properties of the sealant are characterized by the means of mechanical property test,sealing test,insulation test,TG,SEM and XRD.The results show that the sealant has a good adhesion to titanium alloy,sili-con carbide and high temperature alloy steel,the shear strength at room temperature and 800℃is greater than 4.5 MPa;the sealing time of the sealant is 900 s at room temperature and 370 s at 800℃when the pressure drops 10%at the initial pressure of 0.5 MPa;the resistance of sealant at 500 V applied voltage is more than 500 MΩat room temperature and 2 MΩat 800℃;The TG shows that the total weight loss of the sealant is less than 2%at800℃.

关 键 词：无机密封剂 硅酸盐树脂 耐高温 低温固化 

分 类 号：TQ436.6[化学工程]