多孔结构聚酰亚胺基介电材料研究进展  

Research Progress on Polyimide-based Dielectric Materials with Porous Structure

作　　者：杨煜培 莫钦 熊林颖 张雅峰 赵国强 王恒鑫 黄婉芮 彭娅[1] Yang Yupei;Mo Qin;Xiong Linying;Zhang Yafeng;Zhao Guoqiang;Wang Hengxin;Huang Wanrui;Peng Ya(School of Materials Science and Engineering,Xihua University,Chengdu 610039,China)

机构地区：[1]西华大学材料科学与工程学院,成都610039

出　　处：《工程塑料应用》2020年第10期157-161,共5页Engineering Plastics Application

基　　金：四川省教育厅重点项目(12ZA15);教育部“春晖计划”科研项目(Z2010093);“西华杯”大学生创新创业项目(2020136)。

摘　　要：简要介绍了聚酰亚胺作为特种工程材料的特性,以及在微电子领域中作为绝缘封装材料使用的性能要求。从孔洞方向出发,综述了近年内国内外关于制备具有多孔结构的低介电常数聚酰亚胺材料的常用几种方法,主要包括引入不稳定相作为成孔模板剂、与多孔填料复合以及静电纺丝工艺,并对今后关于进一步制备高性能超低介电常数聚酰亚胺材料的方法作出了预测及展望。It was introduced concisely that the characteristics of polyimide as a special engineering material and the performance requirements as an insulating packaging material in the field of microelectronics.From the perspective of pores,several used commonly methods for preparing low-dielectric constant polyimide materials with porous structure at home and abroad in recent years were reviewed,which included introducing unstable phases as pore-forming template agents,compounding with porous fillers and adopting electrostatic spinning process.In addition,the methods of preparing further high-performance ultra-low dielectric constant polyimide materials were predicted and prospected.

关 键 词：聚酰亚胺 多孔结构 低介电常数 绝缘材料 进展 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]