二维材料热传导研究进展  

Recent progresses of thermal conduction in two-dimensional materials

作　　者：吴祥水 汤雯婷 徐象繁[1] Wu Xiang-Shui;Tang Wen-Ting;Xu Xiang-Fan(Center for Phononics and Thermal Energy Science,School of Physical Science and Engineering,Tongji University,Shanghai 200092,China)

机构地区：[1]同济大学物理科学与工程学院,声子学与热能科学中心,上海200092

出　　处：《物理学报》2020年第19期206-238,共33页Acta Physica Sinica

基　　金：广东省重点领域研发计划(批准号:2020B010190004);国家重点研发计划“战略性先进电子材料”重点专项(批准号:2017 YFB0406000);国家自然科学基金(批准号:11674245,11890703,11935010)资助的课题.

摘　　要：以石墨烯和氮化硼为代表的二维材料为研究低维体系热传导及其相关界面热阻提供了一个绝佳的平台.近年的研究表明,二维材料热导率有着丰富的物理图像,如长度效应、维度效应、同位素效应及各向异性等.本文详细综述近十年来二维材料在热传导方面的研究进展.首先简述二维材料热传导测量技术的原理及发展,如热桥法、电子束自加热法、时域热反射法及拉曼法等;其次,介绍二维材料热传导及界面热阻的实验研究进展,讨论其相关物理问题;最后,介绍二维材料在散热应用方面的研究进展,并进行总结、指出存在的问题及进一步展望二维材料未来在散热领域的研究方向与前景.The two-dimensional(2D)materials represented by graphene and boron nitride provide an excellent platform for the study of thermal conduction and the interfacial thermal resistance in low-dimensional system.Recent studies recover exotic physics behind the novel thermal transport properties of 2D materials,such as length effect,dimensional effect,isotopic effect,anisotropic effect,etc.In this review,we introduce the recent progress of thermal properties in 2D materials in the last decade.The principle and development of thermal conduction measurement technologies used in 2D materials are introduced,followed by the experimental progress of thermal conduction and interfacial thermal resistance.Special attention is paid to the abnormal thermal transport and relevant physical problems.Finally,we present thermal management and heat dissipation in 2D electronic devices,summarize and point out the problems and bottlenecks,and forecast the future research directions and foregrounds.

关 键 词：热导率 二维材料 界面热阻 微纳尺度热传导 

分 类 号：TB383.1[一般工业技术—材料科学与工程] TN60[电子电信—电路与系统]