Influencing Factors of Reheating Shrinkage Rate of Glass Substrate on LTPS Process  

作　　者：WANG Weilai TIAN Yingliang WANG Wei LIU Yaru SUN Shibing LüFeng CHEN Xinxin 王伟来;田英良;WANG Wei;LIU Yaru;SUN Shibing;LüFeng;CHEN Xinxin(Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China;National Engineering Laboratoryfor Technology and Equipment on Flat Panel Display Glass,Shijiazhuang 050000,China)

机构地区：[1]Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China [2]National Engineering Laboratoryfor Technology and Equipment on Flat Panel Display Glass,Shijiazhuang 050000,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2020年第4期682-685,共4页武汉理工大学学报（材料科学英文版）

基　　金：Funded by the National Key R&D Program of China(2017YFB0310201-04)。

摘　　要：Different heating treatments with the variation of heating rates,holding temperatures and holding time were used to simulate the LTPS procedure.The experimental results show that the reheating shrinkage rates of glass substrates are rarely changed with increasing the heating rate,but strongly enhanced by raising the holding temperature and time,which shows that the reheating shrinkage of glass is closely related to heat treatment and structural relaxation.The production process of glass is critical to the reheating shrinkage of glass.

关 键 词：low temperature ploy-silicon(LTPS) glass substrates reheating shrinkage rate structural relaxation 

分 类 号：TN383.1[电子电信—物理电子学] TQ171.7[化学工程—玻璃工业]