数模复合印制板电阻焊金带工艺方法  

Process of Resistance Welding Gold Strip for Digital-analog Composite PrintedCircuit Boards

作　　者：李慧[1] 董东[1] 钟雪莲 龚山尧 LI Hui;DONG dong;ZHONG Xuelian;GONG Shanyao(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2020年第5期260-263,270,共5页Electronics Process Technology

基　　金：十三五技术基础科研项目(JSZL2018210B009)。

摘　　要：数模复合印制板是射频应用领域的先进印制电路基板,镀层需兼容SMT焊接及微组装金带焊接需求。主要研究数模复合印制板化学镍金、电镀镍金、化学镍钯金镀层电阻焊金带的可靠性。通过焊点强度测试、失效点光学显微镜分析和焊点微观组织分析,初探界面的连接机理,选择合适镀层,提高数模复合印制板电阻焊金带的可靠性。Digital-analog composite printed circuit board is an advanced printed circuit board in the fi eld of RF application.The coating should be compatible with SMT welding and micro-assembly gold strip welding requirements.The reliability of resistance welding gold strip with ENIG,ENEG and ENEPIG coating on digital analog composite printed circuit board is mainly studied.By means of the strength test of the welding,the optical microscope analysis of the failure points and the microstructure analysis,the bonding mechanism of interface is explored,and the appropriate coating is selected to improve the reliability of resistance welding gold strip of digital analog composite printed circuit boards.

关 键 词：数模复合印制板 化学镍金 电镀镍金 化学镍钯金 

分 类 号：TN605[电子电信—电路与系统]