一种模块化通用垫板工装的研究设计  

Research and Design of AModular and Generic PlateTooling

作　　者：李振亚 赵爱春 LI Zhen-ya;ZHAO Ai-chun(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China)

机构地区：[1]中国航空无线电电子研究所,上海200241

出　　处：《航空电子技术》2020年第3期66-70,共5页Avionics Technology

摘　　要：描述了一种模块化通用垫板工装的设计方法,尤其是一种应用于航空电子印制电路板组件(PCBA)和导热板胶粘作业的垫板工装。将垫板工装分为垫板组件和盖板组件两部分,作业时,按从下至上顺序依次叠放垫板组件、PCBA、导热板和盖板组件,其中PCBA与导热板之间粘附胶膜形成粘接组件。通过移动垫条、更换导热板导向销模块、调整垫柱安装位置等操作,实现规格大小不同、元器件布局不同的PCBA与相应导热板的胶粘作业。A design method of a modular and generic plate tooling is described,which is applied to the adhesive of avionics printed circuit board assembly(PCBA)and heat conducting plate.Plate tooling is composed of backing plate assembly and cover plate assembly.When working,the cushion plate assembly,PCBA,heat conduction plate and cover plate assembly are stacked in a bottom-to-top order,in which the adhesive film is adhered between the PCBA and the heat conduction plate to form the adhesive assembly.By moving the gasket,replacing the heat conduction plate guide pin module,adjusting the installation position of the cushion column and other operations,the adhesive operation between the PCBA and the corresponding heat conduction plate with different specifications and different layout of components is completed.

关 键 词：印制电路板组件(PCBA) 导热板 模块 垫板工装 

分 类 号：V279[航空宇航科学与技术—飞行器设计]