超短脉冲激光在高频腔体加工中的应用研究  

Application of Ultrashort Pulse Laser in High Frequency Cavity Processing

作　　者：李林 吴亚琴 张春晖 吴志强 胡尚平 LI Lin;WU Yaqin;ZHANG Chunhui;WU Zhiqiang;HU Shangping(Nanjing Sanle Group Co.,Ltd.,Nanjin 211800)

机构地区：[1]南京三乐集团有限公司,南京211800

出　　处：《现代制造技术与装备》2020年第9期44-45,共2页Modern Manufacturing Technology and Equipment

摘　　要：针对南京三乐集团有限公司W波段行波管高频腔体电子注孔的结构和尺寸特点,通过开展超短脉冲激光在高频腔体半圆槽结构加工中的工艺研究,分析输出功率、离焦量、扫描速度等工艺参数对加工质量的影响,为超短脉冲激光加工高频腔体半圆槽结构提供了工艺实验依据,最终实现了高频腔体的电子注孔加工,并应用于W波段行波管的研制。According to the structure and size characteristics of the electronic hole injection in the high frequency cavity of the W band traveling wave tube,the influence of output power,defocus and scanning speed on the processing quality is analyzed by the technology research of ultrashort pulse laser in the processing of the high frequency cavity semicircular groove structure.It provides the technological experimental basis for the ultra-short pulse laser processing of the high frequency cavity semicircular groove structure,and finally realizes the electronic hole injection processing of the high frequency cavity,and is applied to the development of the W band traveling wave tube.

关 键 词：超短脉冲激光 高频腔体 半圆槽 工艺参数 

分 类 号：TN249[电子电信—物理电子学] TN124