应变解耦增敏式FBG温度传感器的设计与应用  

Design and Application of Strain Decoupled and Sensitized FBG Temperature Sensor

作　　者：李五一 闫楚良[2] 刘力宏 LI Wuyi;YAN Chuliang;LIU Lihong(Institute of Aeronautics and Astronautics,Nanjing University of Aeronautics and Astronautics Nanjing,210016,China;China National Machinery Industry Corporation Beijing,100083,China)

机构地区：[1]南京航空航天大学航空宇航学院,南京210016 [2]中国机械工业集团有限公司,北京100083

出　　处：《振动．测试与诊断》2020年第5期916-922,1023,共8页Journal of Vibration,Measurement & Diagnosis

基　　金：国家自然科学基金资助项目(50135010)。

摘　　要：为了实现飞机载荷谱飞行实测中对温度参数的精确测量,设计了一种应变解耦增敏式光纤光栅(fiber Bragg grating,简称FBG)温度传感器。通过力学建模分析设计新的传感器结构,对传感器的光纤光栅进行增敏处理,选取铝7075-T6为基底进行全覆盖式封装,提出光纤光栅封装位置与结构件之间无直接接触方式,排除结构形变对温度传感器带来的影响。经标定测试传感器温度灵敏速度为40.4pm/℃,是普通光纤光栅的4倍。搭建实验系统进行其性能探究以及在拉伸实验机上进行解耦特性验证,拉伸实验件的变形对该温度传感器没有影响,与理论分析相符,最终将传感器贴于飞机座舱中进行实际工程应用。实验表明,传感器测得的温度差最大不超过±1℃,表明设计的传感器可以用于实际温度测量中,满足在飞机载荷谱飞行实测中温度参数精确测量的需求。In order to measure the temperature parameters accurately in the flight test of aircraft load spectrum,a strain decoupled and sensitizing fiber Bragg grating(FBG)temperature sensor is designed.The new structure sensor is designed through mechanical modeling analysis,the sensor's FBG is sensitized,and aluminum 7075-T6is selected as the substrate for full-coverage packaging.The indirect contact between the packaging position of FBG and the structure part is proposed to eliminate the influence of structural deformation on the temperature sensor.The temperature sensitive speed of the calibrated test sensor is 40.4pm/℃,which is 4times that of the ordinary fiber grating.Then,the test system is built to explore the performance and the decoupling characteristics are verified on the tensile testing machine.The deformation of the tensile test piece has no influence on the temperature sensor,which is consistent with the theoretical analysis.Finally,sensors are attached to the aircraft cockpit for practical engineering applications.The experimental results show that the maximum temperature difference measured by the sensors is no more than±1℃,which meets the requirements for accurate measurement of temperature parameters in the actual flight test of the aircraft load spectrums and allows the sensor to be used for actual temperature measurement.

关 键 词：飞行实测 应变解耦 增敏 光纤光栅 温度传感器 

分 类 号：TH702[机械工程—仪器科学与技术]