Hot-pressed sintering of W/Cu functionally graded materials prepared from copper-coated tungsten powders  

作　　者：Pei Tian Yi Feng Meng Xia Lan Zhao Cheng-Yu Cai Ke Liu Xiao-Chen Huang 

机构地区：[1]School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China [2]Department of Material Engineering,Zhejiang Industry and Trade Vocational College,Wenzhou 325000,China

出　　处：《Rare Metals》2020年第10期1229-1236,共8页稀有金属（英文版）

基　　金：financially supported by the Wenzhou Public Welfare Technology Research Industry Project(No.G20140042)。

摘　　要：The three-layered(W-60 vol%Cu/W-40 vol%Cu/W-20 vol%Cu)W/Cu functionally graded material(FGM)containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coated tungsten powders.The effects of various sintering temperatures on relative density,microstructure,thermal conductivity,hardness and flexural strength were investigated.Scanning electron microscopy(SEM)and X-ray diffraction(XRD)analysis show that a Cu network extends throughout the W/Cu FGM specimens sintered at 1065℃and the graded structure can be retained perfectly,and W particles are distributed homogeneously.The low-temperature sintering densification of W/Cu FGM arises because the sintering mode of the copper-coated tungsten particles includes just sintering Cu to Cu,rather than Cu to W,Cu to Cu and W to W,as required for conventional powder particles.The relative density of W/Cu FGM sintered at 1065℃for 3 h under a load of25 MPa is 96.1%.The thermal conductivity is up to204 W·m^-1·K^-1 at normal temperature and 150 W·m^-1·K^-1at 800℃.And the Vickers hardness varies with the gradient of different layers from 3.34 to 4.05 GPa.

关 键 词：Copper-coated tungsten powders Hot-pressed sintering W/Cu functionally graded materials Microstructure Performance 

分 类 号：TB34[一般工业技术—材料科学与工程]